Diamond Segments for Basalt Cutting is suitable for the processing of hard and brittle materials. It can not only cut thin slices, but also process curved surfaces. This tool can also be used for the research and repair of small holes. Because of its small friction coefficient, low thermal expansion coefficient and high thermal conductivity, diamond can cut extremely thin chips, which are easy to flow out, have a small affinity with other materials, and are not easy to produce chip tumor. Compared with free abrasive wire saw, the processing efficiency of our Diamond Segments for Basalt Cutting is higher and its energy consumption is lower. In addition, it is simple to operate, can give a long service life. You can rest assure the quality of this device is superior and the price we offer is competitive. We can provide you this product in different specifications, please let us know if you are interested!
Silver or Laser on The Saw Blade
Innerbox + Export Carton